ALD Precursor

ALD technology, powered by highly engineered precursors, allows precise, monolayer-level control over film thickness. This atomic precision is essential in industries where device performance depends heavily on thickness uniformity and repeatability, such as logic transistors, optical coatings, and quantum devices. The ability to finely tune the number of cycles enables reproducible thickness control at the atomic scale — an unmatched benefit over conventional techniques.

High-purity ALD precursors contribute directly to low-defect density, smooth surface morphology, and excellent interface quality. This is particularly important for producing high-k dielectrics, barrier layers, and gate oxides where impurities can lead to dielectric breakdown or mobility degradation. Well-designed ALD precursors facilitate lower thermal budgets, minimal carbon/halide contamination, and better crystallinity control.

Modern ALD precursors support the deposition of a wide range of materials including oxides (e.g., Al₂O₃, HfO₂), nitrides (e.g., TiN, TaN), metals (e.g., Ru, Pt), and sulfides. This versatility has enabled ALD to be used not only in semiconductor manufacturing but also in battery materials, catalysis, photovoltaics, and medical device coatings. The chemical tunability of precursors allows researchers and engineers to customize properties such as refractive index, conductivity, or barrier performance.

ALD precursors are well-suited for integration with high-volume manufacturing (HVM) platforms, including batch and spatial ALD tools. Many precursors are available in high-purity, high-throughput delivery systems, with controlled volatility, low decomposition temperature, and robust storage life. This ensures operational reliability and minimal downtime in industrial-scale production environments.

Certain ALD precursors allow deposition at temperatures below 100°C, enabling compatibility with temperature-sensitive substrates such as polymers, glasses, and flexible electronics. This opens doors to applications in OLEDs, flexible displays, barrier films, and wearable electronics — where traditional vacuum-based methods are often impractical or damaging.