Atomic Layer Deposition (ALD) is a thin-film deposition technique used in nanofabrication. It involves the sequential introduction of gaseous precursors into a reaction chamber, where they react on a substrate surface to form a conformal, uniform coating. ALD is known for its precise control over film thickness and composition, enabling the creation of ultra-thin layers with atomic-level precision. It's widely used in various industries, including electronics, optics, and energy storage, for applications like semiconductor manufacturing and solar cell production.
Atomic Layer Deposition (ALD) is a thin-film deposition technique used in nanofabrication. It involves the sequential introduction of gaseous precursors into a reaction chamber, where they react on a substrate surface to form a conformal, uniform coating. ALD is known for its precise control over film thickness and composition, enabling the creation of ultra-thin layers with atomic-level precision. It's widely used in various industries, including electronics, optics, and energy storage, for applications like semiconductor manufacturing and solar cell production.
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