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Xi'an Zhiyue Material Tech. Co., Ltd.
Xi'an Zhiyue Material Tech. Co., Ltd.

Nickel Vanadium Alloy Sputtering Target (Ni/V)

Nickel Vanadium Alloy Sputtering Target (Ni/V) is vital for thin-film deposition. By blending nickel with vanadium, this alloy provides specialized properties for coating applications. Ni/V targets offer enhanced corrosion resistance, excellent conductivity, and improved mechanical strength, making them ideal for diverse industries requiring high-performance coatings.


Purity: 99.9%

Composition: (93/7 wt%)

  • nickel vanadium alloy sputtering target
  • nickel vanadium alloy sputtering target

Application of Nickel Vanadium Alloy Sputtering Target (Ni/V)

01

Barrier Layers in Semiconductor Devices: Ni/V alloy sputtering targets are utilized to deposit thin films that act as barrier layers in semiconductor devices. These barrier layers are crucial for preventing the diffusion of metal atoms into the silicon substrate, which can degrade the device’s performance. The Ni/V alloy provides an effective barrier that maintains the integrity and reliability of the semiconductor device over time.

02

Under Bump Metallization (UBM): In the packaging of integrated circuits, Ni/V alloys are used in the formation of under bump metallization layers. These layers are essential for creating a robust mechanical and electrical connection between the silicon chip and the metal bumps that connect the chip to its package or directly to a printed circuit board. The Ni/V alloy ensures a strong adhesion and a reliable electrical path, which is critical for device performance.

03

Electromigration Resistance: Electromigration is a significant concern in integrated circuits, where high current densities can lead to the movement of metal atoms, potentially causing circuit failure. Nickel Vanadium alloys are known for their resistance to electromigration, making them suitable for use in thin-film interconnects and other critical paths within semiconductor devices, thereby enhancing the longevity and reliability of these components.

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